MES Integration of 200/300mm FAB for Hynix Numonyx Semiconductor
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Customer
Hynix Numonyx Semiconductor
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Business Area
Semiconductor Manufacturing
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Project term
2005.12 ~ 2006.11
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Key issues
Establishment of a system optimized for operating 200/300mm FAB concurrently
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Deployed product
aimMES
The Challenges
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Implementation of Wafer Level Tracking system
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Classification of data management
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EIS implementation for equipment management
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Intensive Interlock management to prevent accidents by unskilled engineers
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Smooth total FAB Integration through quick response to customization
The Solutions
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Advanced MES
aimMES
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aimMES isManufacturing Execution System(MES) optimized for semiconductor & FPD industries
- Real-time data collection by automation and statistic process management
- Enhancement of factory operation efficiency by standardizing factory information
- Material tracing and management according to previously defined specifications
- Accurate cause analysis and quick response to trouble loss
The Benefits
Before
- Unstable equipment management system
- Insufficient automation technology to apply 200mm/300mm FAB continuously
- High risk of accidents due unskilled workers
After
- Increase productivity by non-product wafer management
- Reduction in the data preparation time by EDB establishment and ETL tool application
- Improvement of process management by the interlock application
- Real-time monitoring of entire equipments by FAB wide FDC application
- Enhancement of the equipment index management by providing various engineering reports and supporting the real-time equipment operation rate
- Fast and successful Ramp-up through provision of localized system functions including Line worker education and site support
